1oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies

Product Details:
Place of Origin: China
Brand Name: OEM
Certification: RoHS,ISO9001、ISO14001、TL9000、TS16949
Model Number: 8-layers main control board FR4 PCB
Payment & Shipping Terms:
Minimum Order Quantity: 10pieces
Price: negotiated
Packaging Details: Standard package
Delivery Time: 7-15days/discuss
Payment Terms: T/T, Western Union,paypal
Supply Ability: 10000pcs/month

Detail Information

Characteristic: TG170, High Reliability, 8-layers Boards High TG Material Mounting Type: Immersion Gold
Product Name: 8-layers Main Control Board FR4 PCB Printed Circuit Board SMT And Pcb Manufacturing Base Material: FR4
Application: Main Control Board MCU Layer(s): 8
Permittivity: 4.3 Thickness: 1.6MM
Outer Copper Thickness: 1oz Copper Thickness(Inner): 1oz
Min Hole Diameter: 0.2mm Minimum Line Width: 0.1mm
(MLI)Min Line Space: 0.1mm
High Light:

1oz 8 Layer Main Control Board

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FR4 PCB Surface Mount Technologies

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1oz PCB Surface Mount Technologies

Product Description

8-layers main control board FR4 PCB Printed Circuit Board SMT and pcb manufacturing service

 

Our circuits boards range from double layers to 24 layers.

The product types include ordinary boards, medium and high Tg boards, involving special processes such as semi-hole,

bonding, impedance, blue glue, carbon oil, gold fingers, blind gongs, buried blind holes , Countersunk holes, etc.;

surface treatment can be ordinary tin spray, lead-free tin spray, immersion gold, electro-nickel gold, electro-hard gold,

QSP, immersion silver, immersion tin or composite processes, etc..

 

Our PCB are widely used in smart electronics, communications Technology, power technology, industrial control,

security engineering, automotive industry, medical control and optoelectronic engineering and other fields.

 

8-layers main control board FR4 PCB Printed Circuit Board Specification:

Base material FR4 Layer(s) 8
Permittivity 4.3 Thickness 1.6mm
Outer copper thickness 1Oz copper thickness(Inner) 1oZ
Mounting Type Immersion gold Min Hole Diameter 0.2mm
Minimum line width 0.1mm (MLI)Min Line Space 0.1mm
Application Electrical box

Characteristic

 

TG170,

High Reliability,

8-layers boards

High TG material

 

8-layers main control board FR4 PCB Printed Circuit Board images:

 

1oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies 0

1oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies 1

 

Impedance PCB(Printed Circuit Board) for Electrical box shown details :

 

1oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies 21oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies 31oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies 4

 

Our PCB factory is fully qualified and has passed a series of certifications including UL, ISO9001, ISO14001,

ISO/TS16949, CQC and so on.

 

Quote Requirement:

 

*Gerber file of the bare PCB board.

*BOM (Bill of material) for assembly.

*To short the lead time, please kindly advise us if there is any acceptable components substitution.

*Testing Guide & Test Fixtures if necessary.

 

 


PCB Assembly Capabilities
Item Technical Parameter
SMT Jointing Min. Space 0201mm
QFP Space Pitch 0.3mm
Min. Package 0201
Min. Size 2*2 inch(50*50mm)
Max. Size 14*22 inch(350*550mm)
Placement Precision ±0.01mm
Placement Precision QFP, SOP, PLCC, BGA
Placement Capability 0805, 0603, 0402, 0201

 

PCB Lead time (workday(s)) Normally
  Single, Double-sided 4 layer 6 layer Over 8 layer HDI
Sample Lead time (Normal) 5-6 6-7 7-8 10-12 10-12
Sample Lead time (Faster) 48-72 hours 5 6 6-7 12
Mass production lead time 7-9 10-12 13-15 16 20
PCB Assembly Lead time
Sample Lead time PCB Fab+Components preparation +PCBA=15 workdays
Mass production lead time PCB Fab+Components preparation +PCBA=21workdays

 

 

 

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