1oz 8 Layer Main Control Board FR4 PCB Surface Mount Technologies
1oz 8 Layer Main Control Board
,FR4 PCB Surface Mount Technologies
,1oz PCB Surface Mount Technologies
8-layers main control board FR4 PCB Printed Circuit Board SMT and pcb manufacturing service
Our circuits boards range from double layers to 24 layers.
The product types include ordinary boards, medium and high Tg boards, involving special processes such as semi-hole,
bonding, impedance, blue glue, carbon oil, gold fingers, blind gongs, buried blind holes , Countersunk holes, etc.;
surface treatment can be ordinary tin spray, lead-free tin spray, immersion gold, electro-nickel gold, electro-hard gold,
QSP, immersion silver, immersion tin or composite processes, etc..
Our PCB are widely used in smart electronics, communications Technology, power technology, industrial control,
security engineering, automotive industry, medical control and optoelectronic engineering and other fields.
8-layers main control board FR4 PCB Printed Circuit Board Specification:
| Base material | FR4 | Layer(s) | 8 |
| Permittivity | 4.3 | Thickness | 1.6mm |
| Outer copper thickness | 1Oz | copper thickness(Inner) | 1oZ |
| Mounting Type | Immersion gold | Min Hole Diameter | 0.2mm |
| Minimum line width | 0.1mm | (MLI)Min Line Space | 0.1mm |
| Application | Electrical box |
Characteristic
|
TG170, High Reliability, 8-layers boards High TG material |
8-layers main control board FR4 PCB Printed Circuit Board images:
Impedance PCB(Printed Circuit Board) for Electrical box shown details :
Our PCB factory is fully qualified and has passed a series of certifications including UL, ISO9001, ISO14001,
ISO/TS16949, CQC and so on.
Quote Requirement:
*Gerber file of the bare PCB board.
*BOM (Bill of material) for assembly.
*To short the lead time, please kindly advise us if there is any acceptable components substitution.
*Testing Guide & Test Fixtures if necessary.
PCB Assembly Capabilities |
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| Item | Technical Parameter | |
| SMT Jointing Min. Space | 0201mm | |
| QFP Space | Pitch 0.3mm | |
| Min. Package | 0201 | |
| Min. Size | 2*2 inch(50*50mm) | |
| Max. Size | 14*22 inch(350*550mm) | |
| Placement Precision | ±0.01mm | |
| Placement Precision | QFP, SOP, PLCC, BGA | |
| Placement Capability | 0805, 0603, 0402, 0201 | |
| PCB Lead time (workday(s)) Normally | |||||
| Single, Double-sided | 4 layer | 6 layer | Over 8 layer | HDI | |
| Sample Lead time (Normal) | 5-6 | 6-7 | 7-8 | 10-12 | 10-12 |
| Sample Lead time (Faster) | 48-72 hours | 5 | 6 | 6-7 | 12 |
| Mass production lead time | 7-9 | 10-12 | 13-15 | 16 | 20 |
| PCB Assembly Lead time | |||||
| Sample Lead time | PCB Fab+Components preparation +PCBA=15 workdays | ||||
| Mass production lead time | PCB Fab+Components preparation +PCBA=21workdays | ||||