Product Description
FR4 PCBA Audio transfer board PCB MBCCL multilayer impedance circuit board for Audio adapter
Specification:
| Base Material |
FR4 |
| Permittivity |
4.3 |
| Layer(s) |
6 |
| Board Thickness |
1.6mm |
| Outer copper thickness |
1oz |
| Inner copper thickness |
1oz |
| Mounting Type |
Immersion gold |
| Min Hole Diameter |
0.25mm |
| Minimum line width |
0.1mm |
| (MLI)Min Line Spacing |
0.1mm |
| Application |
Audio adapter |
| Characteristic |
Hole copper 25UM, thick copper PCB, MBCCL multilayer impedance circuit board |
| Packaging Details |
Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement. |
Angel Technology are a high-tech enterprises is committed to developed by high precision multi-layer circuit boards,allegro and special PCB,providing customers with fast sample,small and medium batch,mass production.
Our factory is 8,000 square meters,including nearly 1/3 of the technical elite. Our factory is fully qualified and has passed a series of
certifications such as UL, ISO9001, ISO14001, ISO/TS16949, CQC and so on.
Our circuits boards range from double layers to 24 layers. The product types include ordinary boards, medium and high Tg boards, involving special processes such as semi-hole, bonding, impedance, blue glue, carbon oil, gold fingers, blind gongs, buried blind holes , Countersunk holes, etc.; surface treatment can be ordinary tin spray, lead-free tin spray, immersion gold, electro-nickel gold, electro-hard gold, QSP, immersion silver, immersion tin or composite processes, etc..
Our PCB are widely used in smart electronics, communications Technology, power technology, industrial control, security engineering, automotive industry, medical control and optoelectronic engineering and other fields.
Quote Requirement:
*Gerber file of the bare PCB board.
*BOM (Bill of material) for assembly.
*To short the lead time, please kindly advise us if there is any acceptable components substitution.
*Testing Guide & Test Fixtures if necessary.
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