Immersion Gold 24 Layer PCB PCBA SMT 1oz Assembled PCB SMT
Immersion Gold 24 Layer PCB
,24 Layer PCB PCBA SMT
,1oz Assembled PCB SMT
Type - C connector PCB,FR4 Print circuits board Immersion gold technology PCBA
Our circuits boards range from double layers to 24 layers.
The product types include ordinary boards, medium and high Tg boards, involving special processes such as semi-hole,
bonding, impedance, blue glue, carbon oil, gold fingers, blind gongs, buried blind holes , Countersunk holes, etc.;
surface treatment can be ordinary tin spray, lead-free tin spray, immersion gold, electro-nickel gold, electro-hard gold,
QSP, immersion silver, immersion tin or composite processes, etc..
Our PCB are widely used in smart electronics, communications Technology, power technology, industrial control,
security engineering, automotive industry, medical control and optoelectronic engineering and other fields.
Specification:
| Base Material | FR4 |
| Permittivity | 4.3 |
| Layer(s) | 4 |
| Board Thickness | 0.86mm |
| Outer copper thickness | 1oz |
| Inner copper thickness | 1oz |
| Mounting Type | Immersion gold |
| Min Hole Diameter | 0.25mm |
| Minimum line width | 0.1mm |
| (MLI)Min Line Spacing | 0.1mm |
| Application | Type-C connectors |
| Characteristic | Board thickness tolerance:+-0.05mm,Dimension tolerance:+-0.01mm, |
| Packaging Details | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. |
Images:
Impedance PCB(Printed Circuit Board) for Electrical box shown details :
Our PCB factory is fully qualified and has passed a series of certifications including UL, ISO9001, ISO14001,
ISO/TS16949, CQC and so on.
We are a high-tech enterprises is committed to developed by high precision multi-layer circuit boards,allegro and special PCB,
providing customers with fast sample,small and medium batch,mass production.
Quote Requirement:
*Gerber file of the bare PCB board.
*BOM (Bill of material) for assembly.
*To short the lead time, please kindly advise us if there is any acceptable components substitution.
*Testing Guide & Test Fixtures if necessary.
PCB Assembly Capabilities |
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| Item | Technical Parameter | |
| SMT Jointing Min. Space | 0201mm | |
| QFP Space | Pitch 0.3mm | |
| Min. Package | 0201 | |
| Min. Size | 2*2 inch(50*50mm) | |
| Max. Size | 14*22 inch(350*550mm) | |
| Placement Precision | ±0.01mm | |
| Placement Precision | QFP, SOP, PLCC, BGA | |
| Placement Capability | 0805, 0603, 0402, 0201 | |
| PCB Lead time (workday(s)) Normally | |||||
| Single, Double-sided | 4 layer | 6 layer | Over 8 layer | HDI | |
| Sample Lead time (Normal) | 5-6 | 6-7 | 7-8 | 10-12 | 10-12 |
| Sample Lead time (Faster) | 48-72 hours | 5 | 6 | 6-7 | 12 |
| Mass production lead time | 7-9 | 10-12 | 13-15 | 16 | 20 |
| PCB Assembly Lead time | |||||
| Sample Lead time | PCB Fab+Components preparation +PCBA=15 workdays | ||||
| Mass production lead time | PCB Fab+Components preparation +PCBA=21workdays | ||||