FR4 Organic Solderability Preservatives OSP PCB 4 Layer Circuit Board
FR4 Organic Solderability Preservatives OSP
,OSP PCB 4 Layer
,OSP PCB 4 Layer Circuit Board
OSP( Organic Solderability Preservatives) process PCB FR4 with black characters circuit boards for power supply
Specification:
| Base Material |
FR4(Flame-retardant 4) |
| Permittivity | 4.3 |
| Layer(s) | 4 |
| Board Thickness | 1.6mm |
| Outer copper thickness | 2oz |
| Inner copper thickness | 2oz |
| Mounting Type | OSP ( Organic Solderability Preservatives) |
| Min Hole Diameter | 0.4mm |
| Minimum line width | 0.2mm |
| (MLI)Min Line Spacing | 0.2mm |
| Application | Power supply |
| Characteristic | With Black characters silkcreen |
| Packaging Details | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. |
Images:
Our PCB are widely used in smart electronics, communications Technology, power technology, industrial control,
security engineering, automotive industry, medical control and optoelectronic engineering and other fields.
Our circuits boards range from double layers to 24 layers.
The product types include ordinary boards, medium and high Tg boards, involving special processes such as semi-hole,
bonding, impedance, blue glue, carbon oil, gold fingers, blind gongs, buried blind holes , Countersunk holes, etc.;
surface treatment can be ordinary tin spray, lead-free tin spray, immersion gold, electro-nickel gold, electro-hard gold,
QSP, immersion silver, immersion tin or composite processes, etc..
Our PCB factory is fully qualified and has passed a series of certifications including UL, ISO9001, ISO14001,
ISO/TS16949, CQC and so on.
Quote Requirement:
*Gerber file of the bare PCB board.
*BOM (Bill of material) for assembly.
*To short the lead time, please kindly advise us if there is any acceptable components substitution.
*Testing Guide & Test Fixtures if necessary.