Winbond 3V 64M BIT Serial Flash Memory Chip W25Q64 Integrated Circuits IC

W25Q64JV W25Q64JVZEIQ W25Q64JVZEIM Winbond 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI FLASH

W25Q64JV W25Q64JVZEIQ W25Q64JVZEIM Winbond 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI FLASH

1. GENERAL DESCRIPTIONS
The W25Q64JV (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power.

The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.
They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data.

The device operates on 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down.

All devices are offered in space-saving packages.

The W25Q64JV array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time.

Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64JV has 2,048 erasable sectors and 128 erasable blocks respectively.

The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. 
The W25Q64JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select,

Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q64JV of up to 133MHz are supported allowing

equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.

2. FEATURES
 New Family of SpiFlash Memories
– W25Q64JV: 64M-bit / 8M-byte
– Standard SPI: CLK, /CS, DI, DO
– Dual SPI: CLK, /CS, IO0, IO1
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
– Software & Hardware Reset(1)
 Highest Performance Serial Flash
– 133MHz Single, Dual/Quad SPI clocks
– 266/532MHz equivalent Dual/Quad SPI
– Min. 100K Program-Erase cycles per sector
– More than 20-year data retention
 Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– <1µA Power-down (typ.)
– -40°C to +85°C operating range
– -40°C to +105°C operating range
 Flexible Architecture with 4KB sectors
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
 Advanced Security Features
– Software and Hardware Write-Protect
– Special OTP protection
– Top/Bottom, Complement array protection
– Individual Block/Sector array protection
– 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
– 3X256-Bytes Security Registers
– Volatile & Non-volatile Status Register Bits
 Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm/8x6-mm
– 16-pin SOIC 300-mil
– 8-pad XSON 4x4-mm
– 24-ball TFBGA 8x6-mm (6x4 ball array)
– 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– 12-ball WLCSP

Specification:

About Winbond Electronics Corporation 

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.

Integrated Circuits (ICs)

Optoelectronics

Crystals, Oscillators, Resonators

Isolators

RF/IF and RFID

Sensors, Transducers

Related IC part Numbers For available:

IC-8 208-mil 64M-bit
W25Q64JVSSIQ
25Q64JVSJQ

SOIC-16 300-mil 64M-bit
W25Q64JVSFIQ
25Q64JVFJQ

WSON-8 6x5-mm
64M-bit
W25Q64JVZPIQ
25Q64JVJQ

WSON-8 8x6-mm
W25Q64JVZEIQ
25Q64JVJQ

XSON-8 4x4-mm
64M-bit
W25Q64JVXGIQ
Q64JVXGJQ

TFBGA-24 8x6-mm(5x5 Ball Array)
W25Q64JVTBIQ
W25Q64JVTBJQ
25Q64JVBIQ
25Q64JVBJQ

TFBGA-24 8x6-mm(6x4 Ball Array)64M-bit
W25Q64JVTCIQ
W25Q64JVTCJQ
25Q64JVCIQ
25Q64JVCJQ

12-ball WLCSP 64M-bit
W25Q64JVBYIQ 6CJI

SOIC-8 208-mil 64M-bit
W25Q64JVSSIN 25Q64JVSIN

WSON-8 6x5-mm 64M-bit
W25Q64JVZPIN 25Q64JVIN

SOIC-8 208-mil 64M-bit W25Q64JVSSIM
W25Q64JVSSJM
25Q64JVSIM
25Q64JVSJM

SOIC-16 300-mil 64M-bit W25Q64JVSFIM
W25Q64JVSFJM
25Q64JVFIM
25Q64JVFJM

WSON-8 6x5-mm
64M-bit W25Q64JVZPIM
W25Q64JVZPJM
25Q64JVIM
25Q64JVJM

WSON-8 8x6-mm 64M-bit
W25Q64JVZEIM
W25Q64JVZEJM
25Q64JVIM
25Q64JVJM

XSON-8 4x4-mm 64M-bit
W25Q64JVXGIM
W25Q64JVXGJM
Q64JVXGIM
Q64JVXGJM

TFBGA-24 8x6-mm(5x5 Ball Array)64M-bit
W25Q64JVTBIM 25Q64JVBIM

Environmental & Export Classifications