F28M35E20B C2000 Real-Time Microcontroller IC Texas Instruments MCU And Processor

F28M35E20B C2000 Real-time microcontroller IC Texas Instruments MCU and processor

Description:

The real-time control subsystem is based on TI’s industry-leading proprietary 32-bit C28x floating-point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures—all as implemented by TI’s TMS320C2000™ Entry performance MCUs and Premium performance MCUs. In addition, the C28-CPU has been enhanced with the addition of the VCU instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms.

The Concerto family is a multicore system-on-chip microcontroller unit (MCU) with independent communication and real-time control subsystems. The F28M35x family of devices is the first series in the Concerto family.

The communications subsystem is based on the industry-standard 32-bit Arm Cortex-M3 CPU and features a wide variety of communication peripherals, including Ethernet 1588, USB OTG with PHY, Controller Area Network (CAN), UART, SSI, I2C, and an external interface.

A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), parity, and code secure memory, as well as documentation to assist with system-level industrial safety certification.

Microcontroller IC (MCU) and processor Specification:

Features:

Master Subsystem — Arm Cortex-M3
Up to 100 MHz
Embedded memory
Up to 512KB of flash (ECC)
Up to 32KB of RAM (ECC or parity)
Up to 64KB of shared RAM
2KB of IPC Message RAM
Five Universal Asynchronous Receiver/Transmitters (UARTs)
Four Synchronous Serial Interfaces (SSIs) and a Serial Peripheral Interface (SPI)
Two Inter-integrated Circuits (I2Cs)
Universal Serial Bus On-the-Go (USB-OTG) + PHY
10/100 ENET 1588 MII
Two Controller Area Network, D_CAN, modules (pin-bootable)
32-channel Micro Direct Memory Access (µDMA)
Dual security zones (128-bit password per zone)
External Peripheral Interface (EPI)
Micro Cyclic Redundancy Check (µCRC) module
Four general-purpose timers
Two watchdog timer modules
Three external interrupts
Endianness: little endian
Clocking
On-chip crystal oscillator and external clock input
Dynamic Phase-Locked Loop (PLL) ratio changes supported
1.2-V digital, 1.8-V analog, 3.3-V I/O design
Interprocessor Communications (IPC)
32 handshaking channels
Four channels generate IPC interrupts
Can be used to coordinate transfer of data through IPC Message RAMs
Up to 74 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins
Glitch-free I/Os
Control Subsystem — TMS320C28x 32-bit CPU
Up to 150 MHz
C28x core hardware built-in self-test
Embedded memory
Up to 512KB of flash (ECC)
Up to 36KB of RAM (ECC or parity)
Up to 64KB of shared RAM
2KB of IPC Message RAM
IEEE-754 single-precision Floating-Point Unit (FPU)
Viterbi, Complex Math, CRC Unit (VCU)
Serial Communications Interface (SCI)
SPI
I2C
6-channel Direct Memory Access (DMA)
Nine Enhanced Pulse Width Modulator (ePWM) modules
18 outputs (16 high-resolution)
Six 32-bit Enhanced Capture (eCAP) modules
Three 32-bit Enhanced Quadrature Encoder Pulse (eQEP) modules
Multichannel Buffered Serial Port (McBSP)
EPI
One security zone (128-bit password)
Three 32-bit timers
Endianness: little endian
Analog Subsystem
Dual 12-bit Analog-to-Digital Converters (ADCs)
Up to 2.88 MSPS
Up to 20 channels
Four Sample-and-Hold (S/H) circuits
Up to six comparators with 10-bit Digital-to-Analog Converter (DAC)
Package
144-Pin RFP PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP)

Temperature options:
T: –40°C to 105°C Junction
S: –40°C to 125°C Junction
Q: –40°C to 125°C Free-Air (AEC Q100 qualification for automotive applications)

F28M35x Concerto™ MCUs Silicon Errata Silicon Revisions E, B, A, 0:

Introduction

This document describes the silicon updates to the functional specifications for the F28M35x microcontrollers (MCUs).

The updates are applicable to: • 144-pin PowerPAD™ Thermally Enhanced Thin Quad Flatpack, RFP Suffix 2 Device and Development Support Tool Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all Concerto MCU devices and support tools. Each Concerto MCU commercial family member has one of three prefixes: x, p, or no prefix (for example, xF28M35H52C1RFPT). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (with prefix x for devices and TMDX for tools) through fully qualified production devices and tools (with no prefix for devices and TMDS for tools). xF28M35... Experimental device that is not necessarily representative of the final device's electrical specifications pF28M35... Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification F28M35... Fully qualified production device Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing TMDS Fully qualified development-support product Devices with prefix x or p and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices with prefix of x or p have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RFP) and temperature range (for example, T).

Microcontroller IC (MCU) and processor part number: