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Home > products > PMIC Chip > TMS320F28335PGFA C2000 REAL-TIME MICROCONTROLLERS Texas Instrument IC MCU

TMS320F28335PGFA C2000 REAL-TIME MICROCONTROLLERS Texas Instrument IC MCU

Category:
PMIC Chip
Price:
Negotiated
Payment Method:
T/T, Western Union
Specifications
Features:
C2000 REAL-TIME MICROCONTROLLERS Texas Instrument IC MCU
Description:
C2000 32-bit MCU With 150 MIPS, FPU, 512 KB Flash, EMIF, 12b ADC
Category:
Electronic Components-Integrated Circuits(IC)
Lead Free Status:
RoHS Compliant, PB Free, Lead Free
Package:
Surface Mounting
Operating Temperature:
-40°C ~ 85°C
RoHS:
Compliant
Base Part Number:
TMS320F28335
High Light:

TMS320F28335 Texas Instrument IC

,

MICROCONTROLLERS Texas Instrument IC MCU

,

TMS320F28335PGFA

Introduction

Integrated Circuits IC-(Electronic Components ) 

TMS320F28335PGFA C2000 REAL-TIME MICROCONTROLLERS Texas Instrument IC MCU

 

Description for the TMS320F28335
C2000™ real-time microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Premium performance MCUs and the Entry performance MCUs.

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications.

 

 

Features for the TMS320F28335

  • High-performance static CMOS technology
    • Up to 150 MHz (6.67-ns cycle time)
    • 1.9-V/1.8-V core, 3.3-V I/O design
  • High-performance 32-bit CPU (TMS320C28x)
    • IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)
  • 16-bit or 32-bit External Interface (XINTF)
    • More than 2M × 16 address reach
  • On-chip memory
    • F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM
    • F28334, F28234: 128K × 16 flash, 34K × 16 SARAM
    • F28332, F28232: 64K × 16 flash, 26K × 16 SARAM
    • 1K × 16 OTP ROM
  • Boot ROM (8K × 16)
    • With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts
  • 128-bit security key/lock
    • Protects flash/OTP/RAM blocks
    • Prevents firmware reverse-engineering
  • Enhanced control peripherals
    • Up to 18 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to 6 event capture inputs
    • Up to 2 Quadrature Encoder interfaces
    • Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)
    • Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)
  • Three 32-bit CPU timers
  • Serial port peripherals
    • Up to 2 CAN modules
    • Up to 3 SCI (UART) modules
    • Up to 2 McBSP modules (configurable as SPI)
    • One SPI module
    • One Inter-Integrated Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 80-ns conversion rate
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Internal or external reference
  • Up to 88 individually programmable, multiplexed GPIO pins with input filtering
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • Advanced debug features
    • Analysis and breakpoint functions
    • Real-time debug using hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™ and SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Endianness: Little endian
  • Package options:
    • Lead-free, green packaging
    • 176-ball plastic Ball Grid Array (BGA) [ZJZ]
    • 179-ball MicroStar BGA™ [ZHH]
    • 179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]
    • 176-pin Low-Profile Quad Flatpack (LQFP) [PGF]
    • 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]
  • Temperature options:
    • A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
    • S: –40°C to 125°C (PTP, ZJZ)
    • Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)

 

  • Specifications:
Category Integrated Circuits (ICs)
  MCU
Mfr Texas Instrument
Series  TI C2000 REAL-TIME MICROCONTROLLERS
Package Tray & Reel (TR)
Part Status Active
PLL Yes
Main Purpose General purpose
Operating Temperature -40°C ~ 85°C
Mounting Type Surface mounting
Package / Case QFP
Product Base Number  TMS320

 

Environmental & Export Classifications:

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

 

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TMP6431DYAT DRV5056A1ELPGMQ1 DRV5056A2QLPGM DRV5056A2ELPGQ1
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Shenzhen Angel Technology Electronics Co Was Founded In HongKong Since 2006, Our branch Located In The Silicon Valley Of China, Shenzhen.

Shenzhen Angel Technology Electronics Co have have obtained the ISO9001 quality management system certification.

The Mission Of Shenzhen Angel Technology Electronics Co has always been to provide Quality Electronics Components To Manufacturers Worldwide.Angel-tech's vision is become the excellent electronic components supplier with the highest satisfaction between employees and customers. Early On We became the Primary channel for project closures And Inventory build-ups for Major Distributors such as Arrow Electronics and Contract Manufacturers. Angel Technology Electronics Co Has since then added Sourcing Of High Quality Components From Local Manufacturers In China.

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