UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G
Manufacturer:
BIWIN
Description:
BIWIN UFS Chips is a next-generation embedded memory chip
Category:
Rotary Position Sensor IC
In-stock:
In Stock
Price:
Negotiated
Payment Method:
T/T, Western Union
Shipping Method:
Express
Specifications
Category:
Electronic Components-Memory
Family:
BIWIN UFS IC Chips
Interface:
UFS 2.1 / UFS 2.1 / UFS 3.1
Application:
Note-Book, Smart Phone
Operating Temperature:
-20°C ~ 85°C
Selection Part Numbers:
UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G
Dimensions:
11.50 × 13.00 Mm
Working Voltage:
UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 2.1: VCC=3.3 V, VCCQ=1.8 V UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V
Capacity:
UFS 2.1: 128 GB - 256 GB UFS 2.1: 128 GB - 256 GB UFS 3.1: 128GB - 512GB
Introduction
UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G UFS IC Chips
UFS
As a next-generation embedded memory chip, the BIWIN UFS chip is three times faster than the latest eMMC 5.1 standard. In addition, UFS 2.1's faster performance could effectively ensure the safe transmission of data without unnecessary lag caused by reading and writing operations, which is the key to the higher speed achieved in UFS 2.1. In addition to its huge advantages in transfer speed, BIWIN UFS 2.1 also has excellent power consumption characteristics.
Application:
Notebook / Smart Phone
Specification:
| Interface | UFS 2.1 / UFS 2.1 / UFS 3.1 |
| Dimensions | 11.50 × 13.00 mm |
| Max. Sequential Read | UFS 2.1: 500 MB/s |
| UFS 2.1: 500 MB/s | |
| UFS 3.1: 1200 MB/s | |
| Max. Sequential Write | UFS 2.1: 856 MB/s |
| UFS 2.1: 856 MB/s | |
| UFS 3.1: 300 MB/s | |
| Frequency | / |
| Capacity | UFS 2.1: 128 GB - 256 GB |
| UFS 2.1: 128 GB - 256 GB | |
| UFS 3.1: 128GB - 512GB | |
| Working Voltage | UFS 2.1: VCC=3.3 V, VCCQ=1.8 V |
| UFS 2.1: VCC=3.3 V, VCCQ=1.8 V | |
| UFS 3.1: VCC=3.3 V, VCCQ=1.2 V / 1.8 V | |
| Working Temperature | -20℃ - 85℃ |
| Approved Verification Platforms | UFS 2.1: Qualcomm: 835, 845... |
| UFS 2.1: Qualcomm: 835, 845… | |
| UFS 3.1: Qualcomm, MediaTek... | |
| Packaging | FBGA153 |
| Application | Notebook / Smart Phone |
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MOQ:
100pieces