BWME8X32H2A-24Gb BWMYAX32P8A-32G BWMYAX32P8A-64G LPDDR IC For Smart Phone
BWME8X32H2A-24Gb BWMYAX32P8A-32G BWMYAX32P8A-64G LPDDR IC For Smart Phone
LPDDR (stands for Low Power Double Data Rate) SDRAM is a kind of DDR, being mainly characterized by its Low Power consumption.
BIWIN Low Power DDR offers a high performance and high cost effective RAM solution. The latest-generation LPDDR4 exhibits a 50% performance increase compared to LPDDR3. LPDDR4's efficient power consumption and higher frequency makes it a favorite choice for contemporary electronic devices.
![]()
Specification:
| Interface | LPDDR 2 |
| LPDDR 3 | |
| LPDDR 4 / LPDDR 4x | |
| LPDDR 5 / LPDDR 5x | |
| Capacity | LPDDR 2: 2 Gb - 8 Gb |
| LPDDR 3: 4 Gb - 16 Gb | |
| LPDDR 4 / LPDDR 4x: 4 Gb - 48 Gb | |
| LPDDR 5 / LPDDR 5x: 16 Gb - 64 Gb | |
| Frequency | LPDDR 2: 533 MHz |
| LPDDR 3: 933 MHz | |
| LPDDR 4 / LPDDR 4x: 1866 MHz | |
| LPDDR 5 / LPDDR 5x: 3200 MHz | |
| Working Voltage | LPDDR 2 / LPDDR 3: VDD1=1.8 V, VDD2=1.2 V, VDDCA=1.2 V, VDDQ=1.2 V |
| LPDDR 4: VDD1=1.8 V, VDD2=1.1 V, VDDQ=1.1 V, LPDDR 4x: VDDQ=0.6 V | |
| LPDDR 5 / LPDDR 5x: VDD1=1.70-1.95 V, 1.8 V NOM, VDD2H=1.01-1.12 V, 1.05 V NOM, VDD2L=VDD2H or 0.87-0.97 V | |
| Approved Verification Platforms | Spreadtrum: 7731E, 9832E, 9820E, SC9850K... |
| Qualcomm: 8909... | |
| MediaTek: MT6580, MT6735, MT6737… | |
| HiSilicon: Hi3798MV310… | |
| Allwinner: B288, A50, B300… | |
| Rockchip: RK3128, RK3228, RK3229... | |
| Amlogic: S905X, S905Y2… | |
| Mstar: MSO9385… | |
| Working Temperature | -20℃ - 85℃ |
| Dimensions | LPDDR 2: 12.00 × 12.00 mm |
| LPDDR 3: 11.50 × 11.00 mm | |
| LPDDR 4: 11.00 × 14.50 mm | |
| LPDDR 4x: 11.50 × 13.00 mm | |
| LPDDR 5 / LPDDR 5x: 12.40 × 15.00 mm | |
| Packaging | FBGA168 / FBGA178 / FBGA200 / FBGA315 |
| Application | Smart Phone |
BWET08U -XXG SPI (Serial Peripheral Interface) NAND Flash IC For Smart Wear Networking
DMMC BGA132 / BGA152 / TSOP48 IC For In-vehicle / Smart Phone / Gaming
BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook
UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G
BWCD24L-04G BWCD24M-08 BWCK1EZH-32G-X BWCL1EZC-32G-X BWCK1EZC05-64G BWCK1KZC02-64G EPOP LPDDR4X IC Chips For Smart Wear AR/VR
BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP IC
| Image | Part # | Description | |
|---|---|---|---|
|
|
BWET08U -XXG SPI (Serial Peripheral Interface) NAND Flash IC For Smart Wear Networking |
The industrial-grade SLC NAND Flash storage, makes up for the low capacity, high price and low speed of SPI NOR Flash
|
|
|
|
DMMC BGA132 / BGA152 / TSOP48 IC For In-vehicle / Smart Phone / Gaming |
DMMC solution adopts a highly integrated design by adding a low-power controller to the NAND flash
|
|
|
|
BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook |
eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging
|
|
|
|
UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G |
BIWIN UFS Chips is a next-generation embedded memory chip
|
|
|
|
BWCD24L-04G BWCD24M-08 BWCK1EZH-32G-X BWCL1EZC-32G-X BWCK1EZC05-64G BWCK1KZC02-64G EPOP LPDDR4X IC Chips For Smart Wear AR/VR |
BIWIN ePOP Chips combines MMC and Mobile LPDDR in a single package with different capacities
|
|
|
|
BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP IC |
BIWIN eMCP Chips is based on MCP (Multi-Chip Packaging) which integrates an eMMC chip and a low-power DRAM solution into
|

