BIWIN
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BWET08U -XXG SPI (Serial Peripheral Interface) NAND Flash IC For Smart Wear Networking |
The industrial-grade SLC NAND Flash storage, makes up for the low capacity, high price and low speed of SPI NOR Flash
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In Stock
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BWME8X32H2A-24Gb BWMYAX32P8A-32G BWMYAX32P8A-64G LPDDR IC For Smart Phone |
LPDDR (stands for Low Power Double Data Rate) SDRAM is a kind of DDR, being mainly characterized by its Low Power consum
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In Stock
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DMMC BGA132 / BGA152 / TSOP48 IC For In-vehicle / Smart Phone / Gaming |
DMMC solution adopts a highly integrated design by adding a low-power controller to the NAND flash
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In Stock
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BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook |
eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging
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In Stock
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UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G |
BIWIN UFS Chips is a next-generation embedded memory chip
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In Stock
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BWCD24L-04G BWCD24M-08 BWCK1EZH-32G-X BWCL1EZC-32G-X BWCK1EZC05-64G BWCK1KZC02-64G EPOP LPDDR4X IC Chips For Smart Wear AR/VR |
BIWIN ePOP Chips combines MMC and Mobile LPDDR in a single package with different capacities
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In Stock
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BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP IC |
BIWIN eMCP Chips is based on MCP (Multi-Chip Packaging) which integrates an eMMC chip and a low-power DRAM solution into
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In Stock
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