BIWIN
- Introduction
- Newest Products
Introduction
BIWIN
Specializes in the research, design, packaging and testing, production, and sales of semiconductor storage and memory products. Its primary offerings include semiconductor memory products and advanced packaging and testing services. Based on application fields, its products are categorized into embedded, PC, industrial and automotive-grade, enterprise-grade, mobile and more storage solutions.
Newest Products
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BWET08U -XXG SPI (Serial Peripheral Interface) NAND Flash IC For Smart Wear Networking |
The industrial-grade SLC NAND Flash storage, makes up for the low capacity, high price and low speed of SPI NOR Flash
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In Stock
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BWME8X32H2A-24Gb BWMYAX32P8A-32G BWMYAX32P8A-64G LPDDR IC For Smart Phone |
LPDDR (stands for Low Power Double Data Rate) SDRAM is a kind of DDR, being mainly characterized by its Low Power consum
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In Stock
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DMMC BGA132 / BGA152 / TSOP48 IC For In-vehicle / Smart Phone / Gaming |
DMMC solution adopts a highly integrated design by adding a low-power controller to the NAND flash
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In Stock
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BWS3BTCDC-60G BWS3BTCDC-120G BGA SSD Flash IC For In-vehicle / Notebook |
eSSD is an embedded solid state driver solution designed in the form of TFBGA packaging
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In Stock
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UFB2750K60N UFB2752Q12N-32G UFB2752Q12N-64G UFB2752Q12N-128G |
BIWIN UFS Chips is a next-generation embedded memory chip
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In Stock
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BWCD24L-04G BWCD24M-08 BWCK1EZH-32G-X BWCL1EZC-32G-X BWCK1EZC05-64G BWCK1KZC02-64G EPOP LPDDR4X IC Chips For Smart Wear AR/VR |
BIWIN ePOP Chips combines MMC and Mobile LPDDR in a single package with different capacities
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In Stock
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BWCC2KD6-32G(32GB+32Gb) BWCC2KD6-64G(64GB+32Gb) BWMA24B-XXGC EMCP IC |
BIWIN eMCP Chips is based on MCP (Multi-Chip Packaging) which integrates an eMMC chip and a low-power DRAM solution into
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In Stock
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